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March 2016

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Wed, 2 Mar 2016 08:50:30 -0500
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text/plain
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text/plain (25 lines)
Hi Victor,
The acceptance criteria don't change. The source side does. The solder 
is sourced from the opposite side, the component side.
In my experience Pb-free solder works better than SnPb solder. It pulled 
back into the hole rather than dripping off the end of the lead.

On 3/2/2016 8:45 AM, Victor Hernandez wrote:
> Fellow TechNetters:
>
>     Is there any IPC guidelines for the Pin In Paste solder process with regards to solder fillet PTH annular ring pad coverage, PTH solder fillet voiding and PTH vertical solder fill as compared to SnPb, LF Solder.
>
> Victor,
>
>
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