TECHNET Archives

March 2016

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 2 Mar 2016 13:45:40 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (12 lines)
Fellow TechNetters:

   Is there any IPC guidelines for the Pin In Paste solder process with regards to solder fillet PTH annular ring pad coverage, PTH solder fillet voiding and PTH vertical solder fill as compared to SnPb, LF Solder.

Victor,


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2