well, I also went to revision E, and I'm still confused
(maybe I should "sleep on it" before I respond?)
I didn't realize they would change Figure numbers across revisions,
but I guess it makes sense
anyway, I only have the "Proposed Standard for Ballot" for revision E
but, unless they changed it during balloting,
Figure 7-89 shows an ACCEPTABLE 75% for all classes
you CANNOT see any solder on the Component Side (the destination side),
you can only see solder only on the Solder Side (the source side)
and it is acceptable for ALL CLASSES
Figure 7-93 and 7-94 show MINIMUM wetting on the Component Side
How can there be required solder wetting on the component side,
if the hole is acceptable at 75% fill from the solder side?
onward thru the fog,
Jack
On Wed, Mar 16, 2016 at 4:50 PM, Anderson, Veronika <
[log in to unmask]> wrote:
> I have different revision (E) of IPC-A-610, but based on you description I
> do not see anything wrong with the pictures - in real life you can have all
> shown on them situations. You cannot see what is inside the hole without
> Automated Optical Inspection machine.
> Therefore, it is commonly assumed, that if you have nice fillet on the
> solder source side and see solder on the destination side - you have your
> 75% fill.
>
> Veronika Anderson C.I.D | Sr. Electrical/Mechanical Design Engineer |
> Excelitas Technologies
>
> My old phone number +1 626.967.9521 x 236 no longer works.
>
> Office: +1 626-593-6025.
> 1330 East Cypress Street, Covina, CA 91724 USA
> [log in to unmask]
> www.excelitas.com
>
>
> -----Original Message-----
> From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack
> Olson
> Sent: Wednesday, March 16, 2016 2:27 PM
> To: [log in to unmask]
> Subject: Re: [DC] Hole Fill and Thermal Relief
>
> I'm trying to solder a connector into plated through-holes.
> IPC-A-600 7.3.5.1 allows a partial fill, see Figure 7-84
>
> In the next section
> IPC-A-600 7.3.5.2 requires wetting on the DESTINATION side which implies
> the hole is FULL of solder
>
> How can you have ANY destination side pad wetting on a PARTIALLY filled
> (but still ACCEPTABLE) hole?
> Those two seem incompatible, so I'm sure I'm misunderstanding.
>
> What's worse is Figure 7-91, which shows a solder joint not wetted to the
> lead.
> How could you ever know how far down the UNWETTED portion extends into the
> hole?
> (It IS labelled as a defect, I agree, but it still might be 75% wetted
> down the barrel) So you have a 360 degree wetted pad labelled as a defect
> because you can see the unwetted lead, but how can you APPROVE a 75% filled
> hole that you CAN'T see if it is wetted or not?
>
> On Wed, Mar 16, 2016 at 2:35 PM, Guy Ramsey <[log in to unmask]> wrote:
>
> > The standard requires the solder be wetted to the lead and the PTH.
> > On Mar 16, 2016 3:30 PM, "Jack Olson" <[log in to unmask]> wrote:
> >
> >> I posted this to IPC TechNet, but I think many people are busy at
> >> APEX this
> >> week:
> >>
> >> -=-=-=-
> >>
> >> Maybe I should know better than to ask two questions in the same
> >> email, but they're related...
> >> I got into a discussion about the hole fill requirement for some
> >> large through-hole power devices and connectors. The supplier is
> >> worried about using a "percentage" hole fill measurement, because he
> >> says that even if the hole is 75% full (or whatever percentage we
> >> want to use) the hole wall will not be WETTED 75%. He maintains that
> >> the cold solder can extend up farther than the actual portion that
> >> makes a good joint. So he is looking at the TOP PAD WETTING for
> >> verification of a good solder joint, even though we don't require it.
> >>
> >> Q1) It seems like an inspection procedure looking for WETTING instead
> >> of HOLE FILL is not what is intended in IPC, but does he have a
> >> point? The hole fill problem is with Selective Soldering, not Reflow
> >>
> >> Q2) Wanting to provide bare board designs using good DFM practices, I
> >> would be willing to reduce my thermal spoke widths so the solder will
> >> flow better, but I can't find a calculation that would tell me what I
> >> need for something like 10A. There is nothing about this in the
> >> IPC-2152 Current Carrying standard. Is there a rough guideline I can
> >> use for current through planes using thermal relief??
> >>
> >> thanks,
> >> Jack
> >>
> >>
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