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February 2016

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From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Fri, 26 Feb 2016 21:12:32 +0000
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Many thanks for the good  insight Ramon.

Rich  Kraszewski
(920) 969-6075

From: Ramon Essers | ETECH-trainingen [mailto:[log in to unmask]]
Sent: Friday, February 26, 2016 3:02 PM
To: TechNet E-Mail Forum; Richard Kraszewski
Subject: Re: [TN] IPC Standard For Max Temp on Through Hole Components

The max Temp also depends on time and the Tg and Td of your PCB and of the type of flux you are using.
Another thing you can ask yourself, Is the temp on the soldering station also the same temp on my tip?
Or are you using another soldering technique like selective wave, intrusive soldering, etc.?
Witch type of coating finish are you using? Do you preheat the PCB?

The best thing you can do is to get in touch with an official IPC training center. An IPC training center is not only there for IPC certification but they can also help you with this sort of questions.
Of course you can also sent me a private mail.

Please note that the component and procedure you are using also have a level of conformance.

Met vriendelijke groet, Kind regards, Mit freundlichen Grüβen,

Ramon Essers
managing Director,  ETECH - trainingen
supporting the electronics industry

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http://www.ipctraining.eu<http://www.ipctraining.eu/>
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Op 26 feb. 2016, om 20:58 heeft Richard Kraszewski <[log in to unmask]<mailto:[log in to unmask]>> het volgende geschreven:

Thanks Dave.

Rich  Kraszewski
(920) 969-6075

From: David Hillman [mailto:[log in to unmask]]
Sent: Friday, February 26, 2016 1:49 PM
To: TechNet E-Mail Forum; Richard Kraszewski
Subject: Re: [TN] IPC Standard For Max Temp on Through Hole Components

Hi Rich - I don't know of a standard that addresses your question. Typically, that is a component specific attribute you need to pull from the technical data sheets. There is IPC JSTD 075 which talks to process temperature/component compatibility but its not slanted to any specific component technology.

Dave Hillman
Rockwell Collins
"stuck in the airport but working"

On Fri, Feb 26, 2016 at 12:22 PM, Richard Kraszewski <[log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]>> wrote:
Does anyone recall which if any standard would address this?


Rich Kraszewski /Plexus


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