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Date: | Fri, 26 Feb 2016 19:58:55 +0000 |
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Thanks Dave.
Rich Kraszewski
(920) 969-6075
From: David Hillman [mailto:[log in to unmask]]
Sent: Friday, February 26, 2016 1:49 PM
To: TechNet E-Mail Forum; Richard Kraszewski
Subject: Re: [TN] IPC Standard For Max Temp on Through Hole Components
Hi Rich - I don't know of a standard that addresses your question. Typically, that is a component specific attribute you need to pull from the technical data sheets. There is IPC JSTD 075 which talks to process temperature/component compatibility but its not slanted to any specific component technology.
Dave Hillman
Rockwell Collins
"stuck in the airport but working"
On Fri, Feb 26, 2016 at 12:22 PM, Richard Kraszewski <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Does anyone recall which if any standard would address this?
Rich Kraszewski /Plexus
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