Hi John,

I'm sure you will get some interesting feedback from TechNet.

Have you subscribed to the "SI-List" listserver?
It has been around for a long time....almost as long as TechNet. :)

If you haven't, subscribe to [log in to unmask]

Between SI-LIST and TechNet you should be well covered with collective experiences on your question.

Brs,
Gerry
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From: TechNet <[log in to unmask]> on behalf of [log in to unmask] <[log in to unmask]>
Sent: Wednesday, February 24, 2016 10:12 AM
To: [log in to unmask]
Subject: [TN] any correlation between annular ring suppression and via failure or delamination in non-woven aramid fiber PCBs?

Good Morning TechNet!

This topic and concern came up in regards to GHz signal routing, but I have not found any references in published literature.  If there are combinations of PCB materials, via dimensions, design parameters, assembly processes and environmental usage conditions that can manifest a reliability concern I'd like to understand these issues and failure mechanisms, but I don't want to chase these ghosts and over constrain ourselves if none have been seen...................

Perhaps this was a problem once upon a time and has been overcome by ongoing technical progress and process improvements?

Thanks for any insights, technical references, history lessons or relevant experience you may be able to share with us.

Regards,

John


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