3x3 mil and starting with Base copper of 17 micron
The problem is due to ground planes on both sides we are having problems in
a few isolated connector holes. Here due to plating of 25 micron in the
hole surface where there is 35 micron plated copper.
This creates under etch problems in 3x3 areas.

V.Ramani
CIT IPC USA
proprietor
KBR (INDIA) LAMINATES & TECHNOLOGY
919844266510
On 16 Jan 2016 01:16, "Louis Hart" <[log in to unmask]> wrote:

> Ramani, what trace width and spacing are you working with? How thick is
> the copper?  Louis Hart
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramani
> Sent: Friday, January 15, 2016 8:54 AM
> To: [log in to unmask]
> Subject: [TN] Pump pressure in a etching machine
>
> Hi,
>
> Can anybody suggest is is the pressure required to do 4x4 pcbs using
> alkaline enchant.
>
> Regards
>
> Ramani
>
> Sent from my iPad
>
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