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January 2016

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Subject:
From:
"Peter G. Houwen" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 12 Jan 2016 08:51:31 -0600
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text/plain (14 lines)
Don't know of any spec for that.

We have used glue dots under the caps, deposited as part of the SMT assembly process.  But our problems with the caps were generally from poor handling during the SMT assembly process.

Pete

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