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December 2015

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 2 Dec 2015 21:10:33 -0500
Content-Type:
text/plain
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As I mentioned before, cd containing solder would be better for high
fatigue requirement.  I am not aware of any lead free can be a drop in fit
to replace it.  Except the wishful thinking of politically corrected type.
 Hopefully, the design was late enough, with full qual, not change
material in the mid of design phase..
> Hi Dave - yes, I would agree with you in terms of the PTH technology use
> due to a high vib/shock product environment. I was thinking more in terms
> of component evolution/introduction timeline rather than a product use
> environment.
>
> Dave
>
> On Wed, Dec 2, 2015 at 1:59 PM, Dave Schaefer <[log in to unmask]>
> wrote:
>
>> "based on the time history listed in the report, the appearance
>> of the solder joint and the technologies on the board (plated thru
>> hole), I
>> would surmise that the solder alloy is tin/lead and not lead-free.
>> However,
>> there is no technical information listed in the report to confirm that
>> assumption."
>>
>> It is conceivable that this assembly was deliberately designed using
>> thru
>> components due to the high shock / vibe operating environment.
>> Although what appears to be a lack of secondary mechanical means of
>> support on larger components raises some doubt to that thought.
>>
>> The cracked joint/lifted land appears to be bottom side ... could be the
>> result of an improperly inserted component subjected to vibration?
>>
>
>
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