Hi Dave - yes, I would agree with you in terms of the PTH technology use
due to a high vib/shock product environment. I was thinking more in terms
of component evolution/introduction timeline rather than a product use
environment.

Dave

On Wed, Dec 2, 2015 at 1:59 PM, Dave Schaefer <[log in to unmask]> wrote:

> "based on the time history listed in the report, the appearance
> of the solder joint and the technologies on the board (plated thru hole), I
> would surmise that the solder alloy is tin/lead and not lead-free. However,
> there is no technical information listed in the report to confirm that
> assumption."
>
> It is conceivable that this assembly was deliberately designed using thru
> components due to the high shock / vibe operating environment.
> Although what appears to be a lack of secondary mechanical means of
> support on larger components raises some doubt to that thought.
>
> The cracked joint/lifted land appears to be bottom side ... could be the
> result of an improperly inserted component subjected to vibration?
>


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