As the BGA's get smaller we found printing paste onto the balls much less 
reliable. For years now we rework all BGA's with a dippable solder paste. 
We use both tin lead and leadfree alloy type 5 solder paste made with with 
Aim's NC256 flux.
Plan the dip tray to coat half of the ball height. Just a few trays can 
service many BGA part numbers.  We x-ray every one of them and the volume 
is very consistent with minimal voiding.



Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Canada
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x7373
[log in to unmask]
www.parker.com/ecd







From:   Bob Wettermann <[log in to unmask]>
To:     <[log in to unmask]>
Date:   2015-12-15 10:40 AM
Subject:        [TN] IPC 7095 and Liquid Fluxes for Rework
Sent by:        TechNet <[log in to unmask]>



Dear Technetters:

In reviewing the IPC 7095 BGA guidelines I noticed a mention of liquid
based fluxes for BGA rework. Has anyone heard of liquid fluxes being 
robust
enough for Sn63 or lead-free rework processes?


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________
-- 
Thanks

Bob Wettermann/BEST