Hi Bob - yes, liquid fluxes do work for BGA rework processes but they are
extremely messy and require very good thermal profile/temperature controls
otherwise you end up with nonactivated flux under the BGA. That situation
usually ends in a corrosion problem. My recommendation is to use a flux
paste or a dippable solder paste for BGA rework tasks.


Dave Hillman
Rockwell Collins
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On Tue, Dec 15, 2015 at 10:39 AM, Bob Wettermann <[log in to unmask]> wrote:

> Dear Technetters:
>
> In reviewing the IPC 7095 BGA guidelines I noticed a mention of liquid
> based fluxes for BGA rework. Has anyone heard of liquid fluxes being robust
> enough for Sn63 or lead-free rework processes?
>
>
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>
> Bob Wettermann/BEST
>


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