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December 2015

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 15 Dec 2015 09:46:26 -0700
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text/plain
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Hi Bob,

You mean remove and replace? I always use a mini-stencil like a Flextac or
Stencil Quik and printed solder paste, never used flux only...

Steve

On Tue, Dec 15, 2015 at 9:39 AM, Bob Wettermann <[log in to unmask]> wrote:

> Dear Technetters:
>
> In reviewing the IPC 7095 BGA guidelines I noticed a mention of liquid
> based fluxes for BGA rework. Has anyone heard of liquid fluxes being robust
> enough for Sn63 or lead-free rework processes?
>
>
> ______________________________________________________________________
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> Thanks
>
> Bob Wettermann/BEST
>


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