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November 2015

TechNet@IPC.ORG

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 4 Nov 2015 10:16:14 -0600
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Fellow TechNetters:

   Is there an IPC guideline/specification for vertical solder fill for mechanical leads, non-functional, for connectors, Heat Sinks, mechanical hold down strap of passive/active components, etc..   Can the 50 - 75% criteria be used on these solder connections?   The same goes for lead protrusion of the leads.

Victor,


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