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November 2015

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Subject:
From:
Louis Hart <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
Date:
Wed, 11 Nov 2015 18:27:04 +0000
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David, Here's my editorial comment:  Assuming the investigation was done in a matter of days, I would not say 'insufficient rinsing' was the root cause.  Louis Hart

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Bealer
Sent: Wednesday, November 11, 2015 12:14 PM
To: [log in to unmask]
Subject: Re: [TN] Unusual solder mask defect...

I have seen a similar situation, the board house investigated the defect and reported back that the root cause was insufficient rinsing so some LPI mask was left in the holes after the solder mask was imaged and developed before it was baked to complete the cure.

David Bealer
SMT Department Manager
office 800-637-2645 x6022   cell 217-474-8760

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Head
Sent: Wednesday, November 11, 2015 10:51 AM
To: [log in to unmask]
Subject: Re: [TN] Unusual solder mask defect...

Just one idea, with a negative film, the fab-houses phototooling/developing process for their artwork when they created the artworks for this design wasn't up to scratch and they have a "grey-scale" spot rather than a "black" spot for the offending pad/hole which is letting some light through.

James

James Head BEng CID+ MIIE MIET
Senior PCB CAD Engineer
Crowcon Detection Instruments Limited
172 Brook Drive
Milton Park
OX14 4SD
Telephone: +44 (1235) 557700 ext. 7885
E-mail: [log in to unmask]

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