Yes, exactly. But all of that is driven by the connector design, and the dimensions should be on the connector vendor's drawing.
I was referring to the standoff.
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, November 10, 2015 1:47 PM
To: [log in to unmask]; Stadem, Richard D.; [log in to unmask]
Cc: [log in to unmask]
Subject: RE: [TN] IPC SMT gull wing Lead to package, connector, co-planarity
By the "block" you are referring to the standoff.? If the block standoff is too high the gull wing leads will not sit on the copper pad adequately or not even solder. On the other hand, if the gull wing leads are higher than standoff the gull wing lead, heel, will see compression when a card is inserted on the connector block.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, November 10, 2015 1:18 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] IPC SMT Lead to package co-planarity
Thank you, Joyce. I was right. There is nothing in the JEDEC spec that defines the dimensioning of the lead with respect to the block.
-----Original Message-----
From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]]
Sent: Tuesday, November 10, 2015 11:58 AM
To: Stadem, Richard D.
Cc: TechNet E-Mail Forum
Subject: RE: [TN] IPC SMT Lead to package co-planarity
https://www.jedec.org/sites/default/files/Master.pdf
> I doubt there would be anything in the JEDEC standards, but I could be
> wrong. Too many variations of a theme to cover them all.
> But I would be sure to expect something on the part drawing.
>
> -----Original Message-----
> From: Yuan-chia Joyce Koo [mailto:[log in to unmask]]
> Sent: Monday, November 09, 2015 7:16 PM
> To: TechNet E-Mail Forum; Stadem, Richard D.
> Subject: Re: [TN] IPC SMT Lead to package co-planarity
>
> check jedec standard for components dwg package. plus your stencil
> paste height after reflow.
> On Nov 9, 2015, at 2:09 PM, Stadem, Richard D. wrote:
>
>> That would be in the component drawing from the vendor.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
>> Sent: Monday, November 09, 2015 12:51 PM
>> To: [log in to unmask]<mailto:[log in to unmask]>
>> Subject: [TN] IPC SMT Lead to package co-planarity
>>
>> Fellow TechNetters:
>>
>> In which IPC STD will I find information of distance between the
>> plastic housing standoff and lead height. INMHO the standoff
>> should rest on the solder mask surface while the lead should have a
>> slight gap to rest on the PWB copper pads. I hope that this makes
>> sense. A print/spec is not readily available.
>>
>> Victor,
>>
>>
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