Thank you, Joyce. I was right. There is nothing in the JEDEC spec that defines the dimensioning of the lead with respect to the block.

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Tuesday, November 10, 2015 11:58 AM
To: Stadem, Richard D.
Cc: TechNet E-Mail Forum
Subject: RE: [TN] IPC SMT Lead to package co-planarity

https://www.jedec.org/sites/default/files/Master.pdf

> I doubt there would be anything in the JEDEC standards, but I could be 
> wrong. Too many variations of a theme to cover them all.
> But I would be sure to expect something on the part drawing.
>
> -----Original Message-----
> From: Yuan-chia Joyce Koo [mailto:[log in to unmask]]
> Sent: Monday, November 09, 2015 7:16 PM
> To: TechNet E-Mail Forum; Stadem, Richard D.
> Subject: Re: [TN] IPC SMT Lead to package co-planarity
>
> check jedec standard for components dwg package.  plus your stencil 
> paste height after reflow.
> On Nov 9, 2015, at 2:09 PM, Stadem, Richard D. wrote:
>
>> That would be in the component drawing from the vendor.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
>> Sent: Monday, November 09, 2015 12:51 PM
>> To: [log in to unmask]
>> Subject: [TN] IPC SMT Lead to package co-planarity
>>
>> Fellow TechNetters:
>>
>>    In which IPC STD will I find information of distance between the
>> plastic housing standoff and lead height.   INMHO the standoff
>> should rest on the solder mask surface while the lead should have a
>> slight gap to rest on the PWB copper pads.   I hope that this makes
>> sense.   A print/spec is not readily available.
>>
>> Victor,
>>
>>
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