The Pre-release drawing doesn't provide very much details on this parameter, measurements.   That is one of the reason I decided to ask the TechNet community.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, November 10, 2015 8:36 AM
To: [log in to unmask]
Subject: Re: [TN] IPC SMT Lead to package co-planarity

I doubt there would be anything in the JEDEC standards, but I could be wrong. Too many variations of a theme to cover them all.
But I would be sure to expect something on the part drawing.

-----Original Message-----
From: Yuan-chia Joyce Koo [mailto:[log in to unmask]]
Sent: Monday, November 09, 2015 7:16 PM
To: TechNet E-Mail Forum; Stadem, Richard D.
Subject: Re: [TN] IPC SMT Lead to package co-planarity

check jedec standard for components dwg package. plus your stencil paste height after reflow.
On Nov 9, 2015, at 2:09 PM, Stadem, Richard D. wrote:

> That would be in the component drawing from the vendor.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Monday, November 09, 2015 12:51 PM
> To: [log in to unmask]
> Subject: [TN] IPC SMT Lead to package co-planarity
>
> Fellow TechNetters:
>
> In which IPC STD will I find information of distance between the
> plastic housing standoff and lead height. INMHO the standoff
> should rest on the solder mask surface while the lead should have a
> slight gap to rest on the PWB copper pads. I hope that this makes
> sense. A print/spec is not readily available.
>
> Victor,
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud
> service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud
> service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________