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November 2015

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Subject:
From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Thu, 5 Nov 2015 17:29:43 +0000
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Victor,

In my opinion, if it's not intended as an electrical conductor and only a mechanical locator/retainer, hole fill doesn't apply. Locating pins are for locating, not grounding, otherwise they would be called grounding pins.

I recall a study wherein the pullout force required to extract a "post" from the component side was virtually the same whether the hole was filled or just bottom wetted.

Ed Popielarski
Engineering Manager


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, November 04, 2015 8:16 AM
To: [log in to unmask]
Subject: [TN] IPC Standards, lead vertical solder fill

Fellow TechNetters:

   Is there an IPC guideline/specification for vertical solder fill for mechanical leads, non-functional, for connectors, Heat Sinks, mechanical hold down strap of passive/active components, etc..   Can the 50 - 75% criteria be used on these solder connections?   The same goes for lead protrusion of the leads.

Victor,


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