Subject: | |
From: | |
Reply To: | |
Date: | Thu, 5 Nov 2015 17:53:58 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Steve,
I agree with Joyce. It depends upon the 'freshness' of your boards and any
preceding thermal exposures they may have experienced prior to wirebonding
(and bonding itself...). The bonds may look good initially, but add a bit
of heat and the bonds will literally fall apart!
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Thursday, November 05, 2015 12:14 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bond
not reliably. but you can do it withstand initial pull strength if you
smash it. based on my understanding...
jk
> Hi All,
> Is it possible to wire bond when the finish is gold over copper - no
> nickel? Thanks. Steve Kelly
>
> Phone(O) (416) 750-8433
> Phone (C) (416) 577-8433
>
> If the recipient to whom this e-mail is sent has an NDA with PFC
> Flexible Circuits Limited this e-mail is considered confidential and
> is subject to any NDA agreements between the respective parties.
>
> See PFC on "How its' Made" in Canada on July 7th at 8 p.m. on the
> Discovery Channel
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
>
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|