Subject: | |
From: | |
Reply To: | |
Date: | Mon, 9 Nov 2015 20:16:11 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
check jedec standard for components dwg package. plus your stencil
paste height after reflow.
On Nov 9, 2015, at 2:09 PM, Stadem, Richard D. wrote:
> That would be in the component drawing from the vendor.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Monday, November 09, 2015 12:51 PM
> To: [log in to unmask]
> Subject: [TN] IPC SMT Lead to package co-planarity
>
> Fellow TechNetters:
>
> In which IPC STD will I find information of distance between the
> plastic housing standoff and lead height. INMHO the standoff
> should rest on the solder mask surface while the lead should have a
> slight gap to rest on the PWB copper pads. I hope that this makes
> sense. A print/spec is not readily available.
>
> Victor,
>
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud
> service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud
> service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|