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check jedec standard for components dwg package. plus your stencil
paste height after reflow.
On Nov 9, 2015, at 2:09 PM, Stadem, Richard D. wrote:
> That would be in the component drawing from the vendor.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Monday, November 09, 2015 12:51 PM
> To: [log in to unmask]
> Subject: [TN] IPC SMT Lead to package co-planarity
>
> Fellow TechNetters:
>
> In which IPC STD will I find information of distance between the
> plastic housing standoff and lead height. INMHO the standoff
> should rest on the solder mask surface while the lead should have a
> slight gap to rest on the PWB copper pads. I hope that this makes
> sense. A print/spec is not readily available.
>
> Victor,
>
>
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