using additional material to improve the marginal design is  
problematic usually in reliability, soon or later.
         jk
On Oct 11, 2015, at 11:39 PM, Deng RongJun wrote:

> The PCBA will be assembled into housing with potting, and wires  
> will be fixed well after assembly.
> Yes, the pad design need to be improved, such as that enlarge pad  
> size to get more strength. But the PCB obviously have problem on  
> some where.
>
>
>
> RongJun Deng
>
> -----Original Message-----
> From: Tan Geok Ang [mailto:[log in to unmask]]
> Sent: Monday, October 12, 2015 10:21 AM
> To: TechNet E-Mail Forum <[log in to unmask]>; Deng RongJun  
> <[log in to unmask]>
> Subject: RE: Solder joint peel off from ENIG board
>
> First your pads design is not the same across the 3 points on the  
> PCB, secondly the wire (high AWG) stressed the solder joints.
> Do tag/put adhesive/epoxy to hold the wires on the PCB so that the  
> stress will be hold down at the epoxy area.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun
> Sent: Friday, 9 October 2015 4:14 PM
> To: [log in to unmask]
> Subject: [TN] Solder joint peel off from ENIG board
>
> Hi all:
>
>
> I have got a solder joint strength issue on ENIG board, the cables  
> soldered on board can be easily detach from pads by a small  
> external force(1kg), the cable mounting process is hand soldering.  
> Failure rate is about 20%.
>
>
>
> We have made SEM and EDS test for solder joint and peel off  
> surface, P Wt% is high than normal.  And we have also made SEM test  
> for 10pcs bare board, the Au thickness is 0.038-0.05um, Ni  
> thickness is 2.8-4.0um.
>
>
>
> As I know high P Wt% will affect solder joint strength, what issue  
> is happened during PCB fabrication process? Anybody know anything  
> about this?
>
> Here comes pictures:
> http://pan.baidu.com/s/1sjl7Ynb
>
> Best regards
> Deng
>
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