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October 2015

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Subject:
From:
Tony Lentz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tony Lentz <[log in to unmask]>
Date:
Fri, 9 Oct 2015 13:05:40 +0000
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Hello Ed,

This condition looks a lot like skip plating from the ENIG process.  The bottom left photo has a copper coloration to it which indicates a very thin layer of nickel.  Skip plating can be somewhat randomly distributed over a board because it can be caused by contamination or heavy copper oxide on the pads prior to ENIG plating.   The result of skip plating is areas with very little to no nickel plating ranging up to areas with the normal amount of nickel plating.  

Best regards,

Tony Lentz
FCT Assembly
Field Application

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, October 8, 2015 9:30 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG VS. ammonia

Hi Ed,

Here you go:

http://stevezeva.homestead.com/Ed_BP.jpg

Steve

On Thu, Oct 8, 2015 at 9:08 AM, Ed Popielarski <[log in to unmask]>
wrote:

> Hi Steve,
>
>
>
> Could you please post the attached?
>
>
>
> Ed Popielarski
>
> Engineering Manager
>
>
>
>                                970 NE 21st Ct.
>
>                               Oak Harbor, Wa. 98277
>
>
>
>                               Ph: 360-675-1322
>
>                               Fx: 206-624-0695
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>                               Cl: 949-581-6601
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>
>
>
>
>
>
>        “It's one kind of victory to slay a beast, move a mountain, and 
> cross a chasm, but it's another kind altogether to realize that the 
> beast, the mountain, and the chasm were of your own design.”
>
>
> https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&s
> pn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A
>
>
>
> *From:* Steve Gregory [mailto:[log in to unmask]]
> *Sent:* Wednesday, October 07, 2015 2:15 PM
> *To:* TechNet E-Mail Forum; Ed Popielarski
> *Subject:* Re: [TN] ENIG VS. ammonia
>
>
>
> Hi Ed,
>
> I use peelable latex mask quite often here (mostly for conformal coat
> masking) and have never had it tarnish ENIG. I do know that some masks 
> contain some ammonia (some formulations more than others) and the ones 
> that do usually have a note not to use on OSP finishes, but I've not 
> seen such a note for ENIG. IHMO you got something else going on there 
> besides the peelable mask causing the problem...
>
> Steve
>
>
>
> On Wed, Oct 7, 2015 at 2:46 PM, Ed Popielarski 
> <[log in to unmask]>
> wrote:
>
> Hi all,
>
> I Have a batch of boards showing what I believe to be black pad. This 
> is surfacing at thru hole (solderability, some pads are turning 
> orange). One person suggested the peelable solder mask contains 
> ammonia and this is what is causing it. I disagree.
>
> Suggestions or comments?
>
> Ed Popielarski
> Engineering Manager
>
> [cid:[log in to unmask]]
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0695
>                               Cl: 949-581-6601
>
>
>
>        "It's one kind of victory to slay a beast, move a mountain, and 
> cross a chasm, but it's another kind altogether to realize that the 
> beast, the mountain, and the chasm were of your own design."
>
> https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&s
> pn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A
>
>
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