does not like to have that much gold... 0.038 micron is less than 1
micro-inch of gold.  you might have Ni oxide on surface to prevent good
joint... you might also have some Cu oxide on the surface, if your Ni
plating is crappy and porosity is high... can't see picture... did you buy
cheap?  (based on the amount of gold you are having).
> EDS doesn't normally show the correct P content you begin with. 
>
> I can not see any images.
>
> ‎Regards,
>
> Vladimir
> SENTEC
>
> Sent from my BlackBerry 10 smartphone.
>   Original Message  
> From: Deng RongJun
> Sent: Friday, October 9, 2015 10:13
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: [TN] Solder joint peel off from ENIG board
>
> Hi all:
>
>
> I have got a solder joint strength issue on ENIG board, the cables
> soldered on board can be easily detach from pads by a small external
> force(1kg), the cable mounting process is hand soldering. Failure rate is
> about 20%.
>
>
>
> We have made SEM and EDS test for solder joint and peel off surface, P Wt%
> is high than normal. And we have also made SEM test for 10pcs bare board,
> the Au thickness is 0.038-0.05um, Ni thickness is 2.8-4.0um.
>
>
>
> As I know high P Wt% will affect solder joint strength, what issue is
> happened during PCB fabrication process? Anybody know anything about this?
>
> Here comes pictures:
> http://pan.baidu.com/s/1sjl7Ynb
>
> Best regards
> Deng
>
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