it depends on what is your product and how the line is balanced and
constructed. If overall expose to the room within 1hr or less, you might
not see that much of difference.. if you run the assembly one shift and
let it stay overnight for the next day to be completed, you might see a
some difference. (wetting angle of your exposed surface changes a little
within an hour or so, but most of clean room, 24-48 hours will show
significant difference). It all depends what is your requirement. if you
are building a LCD, one lady with makeup without wearing a mask smile to
the LCD will cause enough damage... ;-)
have a nice weekend and go Blue Jays...
> Thanks to your answers.
> I understand that the specification gives recommendations and not
> requirements.
> And I agree you need a minimum of cleanliness if you want to produce good
> assemblies.
>
> Best regards,
> CANTAGALLO Luigi
>
> [@@ OPEN @@]
> -----Message d'origine-----
> De : TechNet [mailto:[log in to unmask]] De la part de Stadem, Richard D.
> Envoyé : jeudi 8 octobre 2015 17:31
> À : [log in to unmask]
> Objet : Re: [TN] Clean room
>
> I agree with Doug, but the particle count in the Class 3 assembly area
> should be kept relatively low. You do not want a bunch of cardboard boxes,
> etc, stored in the area or you will have some issues with fibers in the
> solder.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
> Sent: Thursday, October 08, 2015 10:25 AM
> To: [log in to unmask]
> Subject: Re: [TN] Clean room
>
> I would agree with what Gregg has written, but want to stress that you do
> NOT need a clean room facility to make IPC Class 3. We do almost all
> class
> 3 work and the only cleanroom stuff is in our microelectronics assembly
> rooms. A generally clean workplace suffices for most everything.
>
>
> Doug Pauls
> Principal Materials and Process Engineer Rockwell Collins
>
> On Thu, Oct 8, 2015 at 10:05 AM, Gregg Owens <
> [log in to unmask]> wrote:
>
>> J-STD-001F Has some basic requirements in Section 4. For class 3:
>>
>> 4.1 ESD Mfg shall establish and implement a documented ESD control
>> program per ANSI/ESD-S20.20 or otherwise specified.
>> 4.2 Cleanliness and ambient environments in all works areas shall be
>> maintained at levels the prevent contamination or deterioration of
>> tools, materials and surfaces to be soldered or conformally coated.
>> Eating, drinking, and/or use of tobacco products is prohibited in the
>> work area.
>> 4.2.1 Environmental Controls: Should (no requirement) be enclosed,
>> temperature and humidity controlled, and maintained at a positive
>> pressure 4.2.2. Temp and Humidity: At 30% or lower, the Mfg shall very
>> ESD control is adequate. For process control, more restrictive
>> temperature and humidity may be required.
>>
>> For cleanroom applications ISO 14644-1 Clean Room Standards is the
>> current contractual standard. US FED-STD-209E was cancelled in 2001
>> but is still widely used.
>>
>> Gregg
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of CANTAGALLO Luigi
>> Sent: Wednesday, October 07, 2015 10:58 PM
>> To: [log in to unmask]
>> Subject: [TN] Clean room
>>
>> Hello Technetters.
>>
>> Is there an IPC specification which gives the quality levels of
>> workshops (temperature, humidity, cleanliness) according to the
>> quality of the assemblies?
>> For example, assemblies IPC class 3 must be necessarily assembled in
>> clean rooms or just with control of humidity and temperature?
>>
>> Best regards,
>>
>> CANTAGALLO Luigi
>>
>> [@@ OPEN @@]
>>
>>
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