EDS doesn't normally show the correct P content you begin with. 

I can not see any images.

‎Regards,

Vladimir
SENTEC

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  Original Message  
From: Deng RongJun
Sent: Friday, October 9, 2015 10:13
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Solder joint peel off from ENIG board

Hi all:


I have got a solder joint strength issue on ENIG board, the cables soldered on board can be easily detach from pads by a small external force(1kg), the cable mounting process is hand soldering. Failure rate is about 20%.



We have made SEM and EDS test for solder joint and peel off surface, P Wt% is high than normal. And we have also made SEM test for 10pcs bare board, the Au thickness is 0.038-0.05um, Ni thickness is 2.8-4.0um.



As I know high P Wt% will affect solder joint strength, what issue is happened during PCB fabrication process? Anybody know anything about this?

Here comes pictures:
http://pan.baidu.com/s/1sjl7Ynb

Best regards
Deng

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