TECHNET Archives

October 2015

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 8 Oct 2015 18:26:22 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
I have never seen anything like it either, and I am certainly no expert in die fab. But I do know that there are at least 3 or 4 locations in the pictures where it certainly appears as if the contamination goes right into the silicon layers and emerges later in a linear direction.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Thursday, October 08, 2015 1:11 PM
To: [log in to unmask]
Subject: Re: [TN] Ropy grunge in IC

Interesting idea. I've never seen anything like what you're describing. That "trace" it appears to dive beneath is actually a space between outer layer conductors. So it would have to be on top of outer metal, then dive beneath the area covered by dielectric, then re-emerge on top of the metal. Could you describe a production sequence that would create that? I've seen lots of bare die, but I really know little about the wafer fabrication. In the upper right of that central photo is clearly a piece of debris sitting on top of the die surface (it's out of focus, so I'm presuming it is above the plane of the die surface and not below.)

-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Thursday, October 08, 2015 1:32 PM
To: TechNet E-Mail Forum; Wayne Thayer
Subject: RE: [TN] Ropy grunge in IC

I respectfully disagree. If you look closely, it appears that some sections of the rope-like material are actually intertwined and run under the traces inside the die. It appears that the contaminant was there when the die was made. But on the other hand some of the same stuff is seen around the edges of the die as well. It is hard to tell.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Thursday, October 08, 2015 11:47 AM
To: [log in to unmask]
Subject: Re: [TN] Ropy grunge in IC

That LOOKS like just a poorly cleaned decapsulation job. The stuff you're asking about could either be from the overmold material or some deteriorating seals in the decapsulator. So my instinct is that it's a "red herring" in your failure analysis. This contaminant appears to be EXTREMELY thin, no more than
5 microns, because there doesn't seem to be a detectable difference in focus height between this and adjacent circuitry (unless the image is actually a composite of several different pictures at different focus heights).

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, October 08, 2015 12:31 PM
To: [log in to unmask]
Subject: Re: [TN] Ropy grunge in IC

Hi Julie,

Have your photo up, it's here:

http://stevezeva.homestead.com/3CK_2nd_decap_-_multiview.jpg

Steve

On Thu, Oct 8, 2015 at 10:21 AM, Julie Silk <[log in to unmask]> wrote:

> We had an intermittent failure on a part and after decap, there was a 
> rope-like line that seemed to weave in and out of the circuitry.  I'm 
> having Steve Gregory post a picture.  I'd like your thoughts on what 
> is going on.  We're consulting with the supplier, but I'd like your input.
>

-- 


This email and any attachments are only for use by the intended
recipient(s) and may contain legally privileged, confidential, proprietary or otherwise private information. Any unauthorized use, reproduction, dissemination, distribution or other disclosure of the contents of this e-mail or its attachments is strictly prohibited. If you have received this email in error, please notify the sender immediately and delete the original.


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2