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October 2015

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Subject:
Re: No-wetting on Mini USB (Nickel plating)
From:
Robert Kondner <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 29 Oct 2015 16:08:33 -0400
Content-Type:
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When soldering to the nickel straps used as battery tabs I found a RMA flux was required. No cleans and WS did not work near as well.

Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Thursday, October 29, 2015 2:31 PM
To: [log in to unmask]
Subject: Re: [TN] No-wetting on Mini USB (Nickel plating)

Hello RongJun Deng! Soldering to nickel finishes is typically done using aggressive flux formulations because of the nickel oxide that forms on nickel finishes. Check with your flux supplier to if the flux formulations you are using are compatible for soldering nickel finishes.

Dave Hillman
Rockwell Collins

On Thu, Oct 29, 2015 at 2:32 AM, Deng RongJun <[log in to unmask]> wrote:

> Hi Technetters
>
> I have got a problem with a SMT type mini USB connector. The four pins 
> contacted shield are no-wetting after reflow soldering.  But can be 
> solder well by iron.
> The pins only plated by Nickel, is it possible the oxidation film 
> creating on pin surface and then affect soldering?
>
> Picture:
> https://goo.gl/photos/qap1CBEWzUEJEc5i6
>
> Thanks in advance.
>
> RongJun Deng
>
>
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