Hi Juliano,
Your main purpose is to drive out the miosture that could delaminate your PCB or components when locally heating for rework. This being said, the applicable standards are IPC-1601 for PCBs and J-STD-020A/J-STD-033 for components. Note the J-STDs are free for download on jedec.org.
Very rough figures are about 24 hours of bake at 125 C. You will need to do your homework and make sure to be at least 5 C below the Tg (glass transition temperature) of your PCB laminate, for instance if Tg is 120 C, baking at 125 C is problematic.
Best regards,
Ioan Tempea, P. Eng.
Manufacturing Engineer, Satellite Systems
MacDonald, Dettwiler and Associates Corporation, 21025 Trans-Canada Highway, Ste-Anne-de-Bellevue, QC, Canada H9X 3R2
Tel: +1-514-457-2150 x3556
www.mdacorporation.com
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-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Datacom - Juliano Ribeiro
Envoyé : Friday, October 23, 2015 7:07 AM
À : [log in to unmask]
Objet : [TN] Baking to populated boards to rework
Hi folks
We would like to know how much time and temperature to baking before rework.
We have some boards that is necessary to replace the BGA, but the boards are in the warehouse around 6 months. We would like baking in those boards before replace the BGA, so what's the time and temperature?
Thank you
_____________________________
Juliano Bettim Ribeiro
DATACOM
ENGENHARIA DE PROCESSOS
Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000
+55 (51) 8446-2135
+55 (51) 3933-3000
Ramal: 3484
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<http://www.datacom.ind.br/> www.datacom.ind.br
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