I am a little confused regarding the requirement stated in J-STD-001 for the humidity level in the facility.

Reading the standard, I understand that the value of 30% RH (minimum) is only referred to prevent damages induced by an electrostatic discharge, but not for soldering. Is it correct? Of course, the soldering process shall meet all the requirements and also the solder joints.
 
And a last question. Does the J-STD-001 require keeping records of the readings of temperature and humidity in the assembly workshop? Is it acceptable a system that starts to work when the humidity drops to a certain level (for example 40%) even if that system does not have the possibility to save these data?

 
Thank you.