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September 2015

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 16 Sep 2015 13:30:34 -0400
Content-Type:
text/plain
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text/plain (72 lines)
It would be similar to one formed on ENIG. ANYTHING CAN BE MEASURED.

Vladimir

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: Victor Hernandez
Sent: Wednesday, September 16, 2015 13:10
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: Re: [TN] ENEPIG Question?

Can this IMC formation be measured at a microscopic level?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, September 16, 2015 12:01 PM
To: [log in to unmask]
Subject: Re: [TN] ENEPIG Question?

Jeffrey,

Pd also dissolves into the joint, and again you are forming an intermetallic with the nickel.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jenkins, Jeffrey A @ CSG - LINKABIT
Sent: Wednesday, September 16, 2015 12:02 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] ENEPIG Question?

Hi All,

Quick question, with an ENIG finish, I know the gold dissolves into the joint and we solder to the Ni.

But what about ENEPIG? I'm assuming the Au will dissolve, but what happen with the Pd? Does it stay put or also dissolve into the joint?

Inquiring minds want to know.

Thanks,

-Jeffrey

Jeffrey A. Jenkins
Sr. PCB Staff Designer, CID+/CIT
L-3 Communications, Linkabit Division
Work: 858-552-9832
Email: [log in to unmask]



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