Thank-you Richard, noted your points about HASL. Much appreciated.
Thank-you
Mumtaz
858-795-0112
Peregrine Semiconductor
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, September 16, 2015 5:22 AM
To: [log in to unmask]
Subject: Re: [TN] Solder paste print thickness vs reflowed thickness for SMT packages
And on a HASL-finished PWB, it could vary from 0% to 100% or more in finished volume.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tony Lentz
Sent: Tuesday, September 15, 2015 4:23 PM
To: [log in to unmask]
Subject: Re: [TN] Solder paste print thickness vs reflowed thickness for SMT packages
Hello Mumtaz
For a 5 mil stencil you should expect a printed paste height of about 3.0 to 4.0 mils. This depends largely on solder paste type and transfer efficiency. After reflow this height will typically be 2.0 to 3.0 mils depending upon the spread of the paste over the pad. These numbers also depend upon component placement which deforms / smashes the solder paste.
For a 4 mil stencil you should expect the printed height to be 2.0 to 3.0 mils and the reflowed solder height to be 1.0 to 2.0 mils. Again these numbers will vary.
As Joyce said, it's best to take some measurements of paste height followed by cross section of the solder joints after reflow. That would give hard data on a specific design.
Best regards,
Tony Lentz
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Tuesday, September 15, 2015 11:53 AM
To: [log in to unmask]
Subject: [TN] Solder paste print thickness vs reflowed thickness for SMT packages
Dear All, Does anyone have estimates ,measurements or correlation for printed paste thickness ( lead free- No clean) vs reflowed paste height for the 5 mil and 4 mil paste print thicknesses.
Thank-you
Mumtaz
858-795-0112
Peregrine Semiconductor
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