No, that is not possible. The variations in the worldwide electronics soldering industry go far beyond what most of us see with typical ENIG, IAg, IAuCu (flash gold on copper), HASL, Pb-free HASL, OSP, and ten thousand billion different variations of component lead basis metals involved. How could anyone possibly characterize all of the different combinations and put an appropriate IMF thickness for each one? The charted document would be bigger than great-gramma's Bible.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, September 16, 2015 9:51 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Reworked Intermetallic
Does IPC STD provide a guideline for IMC formation thickness, ENIG or Cu, after 1x, 2x, 3x, 4x, 5x and 6x Forced RW? IMC formation thickness varies by type of solder, SnPb and LF Solder. Let’s keep the discussion going!!!
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Wednesday, September 16, 2015 9:38 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Reworked Intermetallic
10 microns thick layer is a perfect way for a disaster down the road :-).
There are no parameters for E-Ni, but the appearance of the interface and a P-enriched layer is important.
Vladimir
Sent from my BlackBerry 10 smartphone on the Rogers network.
Original Message
From: Victor Hernandez
Sent: Wednesday, September 16, 2015 10:11
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: Re: [TN] BGA Reworked Intermetallic
On ENIG surface I don't see much of an increase in the IMC formation thickness. However, on Cu it is a different story. I have measured IMC formation greater than 10 microns. Not sure of the below statement about E-NI parameter. Please explain!!!
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Wednesday, September 16, 2015 8:12 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Reworked Intermetallic
The "magic" Number should stay the same 1-3 micron but you'd also have to keep an eye on what happened to the layer of E-Ni underneath.
Regards,
Vladimir
SENTEC
Sent from my BlackBerry 10 smartphone on the Rogers network.
Original Message
From: Datacom - Juliano Ribeiro
Sent: Wednesday, September 16, 2015 09:09
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] BGA Reworked Intermetallic
Hi to all,
When we reworked the BGA, removed the component of the board and replacement another BGA, what's the intermetallic thickness ideal after the rework?
p.s: Our pcb is ENIG finished and the solder is Tin Lead.
_____________________________
Juliano Bettim Ribeiro
DATACOM
ENGENHARIA DE PROCESSOS
Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000
+55 (51) 8446-2135
+55 (51) 3933-3000
Ramal: 3484
[log in to unmask] www.datacom.ind.br
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