On ENIG surface I don't see much of an increase in the IMC formation thickness.  However, on Cu it is a different story.   I have measured IMC formation greater tham 10 microns.   Not sure of the below statement about E-NI parameter.   Please explain!!!

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Wednesday, September 16, 2015 8:12 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Reworked Intermetallic

The "magic" Number should stay the same 1-3 micron but you'd also have to keep an eye on what happened to the layer of E-Ni underneath.

Regards,

Vladimir

SENTEC

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message
From: Datacom - Juliano Ribeiro
Sent: Wednesday, September 16, 2015 09:09
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] BGA Reworked Intermetallic

Hi to all,



When we reworked the BGA, removed the component of the board and replacement another BGA, what's the intermetallic thickness ideal after the rework?



p.s: Our pcb is ENIG finished and the solder is Tin Lead.



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DATACOM

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