The volume is about 40-45% after reflow.
________________________________________
From: TechNet [[log in to unmask]] on behalf of Mumtaz Bora [[log in to unmask]]
Sent: Wednesday, 16 September, 2015 5:19:36 AM
To: [log in to unmask]
Subject: Re: [TN] Solder paste print thickness vs reflowed thickness for SMT packages
Thank-you JK, noted your points and suggestions. Much appreciated.
Thank-you
Mumtaz
858-795-0112
Peregrine Semiconductor
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, September 15, 2015 2:17 PM
To: TechNet E-Mail Forum; Mumtaz Bora
Subject: Re: [TN] Solder paste print thickness vs reflowed thickness for SMT packages
(1) flux loading - and type of flux, no clean got low residue and no residue type, the transfer efficiency also play a role
(2) package type and lead geometry/surface finishing type also play a role
- including wetting characteristic of the lead
(3) best is to laser scan the print paste thickness and cross section your pwa in some area and get few package style for your application - your own database (better use for old paste that may have questionable transfer efficiency, especially, small aperture type).
my 2 cents.
jk
> Dear All, Does anyone have estimates ,measurements or correlation
> for printed paste thickness ( lead free- No clean) vs reflowed paste
> height for the 5 mil and 4 mil paste print thicknesses.
>
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine Semiconductor
>
>
> CONFIDENTIALITY NOTE: The information transmitted, including
> attachments, is intended only for the person(s) or entity to which it
> is addressed and may contain confidential and/or privileged material.
> Any review, retransmission, dissemination or other use of, or taking
> of any action in reliance upon this information by persons or entities
> other than the intended recipient is prohibited. If you received this
> in error, please contact the sender and destroy any copies of this information.
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
>
CONFIDENTIALITY NOTE: The information transmitted, including attachments, is intended only for the person(s) or entity to which it is addressed and may contain confidential and/or privileged material. Any review, retransmission, dissemination or other use of, or taking of any action in reliance upon this information by persons or entities other than the intended recipient is prohibited. If you received this in error, please contact the sender and destroy any copies of this information.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
