(1) flux loading - and type of flux, no clean got low residue and no
residue type, the transfer efficiency also play a role
(2) package type and lead geometry/surface finishing type also play a role
- including wetting characteristic of the lead
(3) best is to laser scan the print paste thickness and cross section your
pwa in some area and get few package style for your application - your own
database (better use for old paste that may have questionable transfer
efficiency, especially, small aperture type).
my 2 cents.
     jk
> Dear All,  Does anyone have estimates ,measurements or  correlation for
> printed paste thickness ( lead free- No clean) vs reflowed paste  height
> for the 5 mil and 4 mil  paste print thicknesses.
>
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine  Semiconductor
>
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