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September 2015

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Tue, 15 Sep 2015 18:37:29 +0000
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Thankyou Leland, Much appreciated. Yes, we are looking for some rough calculations for package assembly.


Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


-----Original Message-----
From: Leland Woodall [mailto:[log in to unmask]]
Sent: Tuesday, September 15, 2015 11:31 AM
To: 'TechNet E-Mail Forum'; Mumtaz Bora
Subject: RE: [TN] Solder paste print thickness vs reflowed thickness for SMT packages

Mumtaz,

This is going to depend upon several variables, including the flux content of your paste, your aperture to pad ratio (reductions, over-printing, etc.), and the spread properties of the paste itself.  Aperture fills will also vary with the type of squeegee blade and pressures used in the printing process.  Paste volumes will also fluctuate with changes in print speed.  I assume your process is set to perform on-contact printing, as differences in snap-off distances will affect your deposition too.

In a perfect world, deposited height would equal stencil thickness, and reflowed height (assuming 100% print to pad coverage) would be reduced by the flux percentage of your paste (commonly 10% or so).

That will give you a rough calculation, but only a starting point.

Hope this helps.

Leland


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Tuesday, September 15, 2015 1:53 PM
To: [log in to unmask]
Subject: [TN] Solder paste print thickness vs reflowed thickness for SMT packages

Dear All,  Does anyone have estimates ,measurements or  correlation for printed paste thickness ( lead free- No clean) vs reflowed paste  height for the 5 mil and 4 mil  paste print thicknesses.


Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


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