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September 2015

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 30 Sep 2015 13:13:50 -0400
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good. like the 3g wire bond pull test... (you use a rubber hammer to ham
the wire down to the substrate, you got pull strength of 3g with the
smashed Al wire).
> The IPC SMT land bond strength test method was cancelled due to
> 1) uncertainty of the method
> 2) ultimate tensile strength doesn't model the actual failure mode risks
> very well
>
> Note that:
> 2.4.1 has much lower uncertainty because it provides a circular land, with
> hole to build ideal attachment geometry.
> Ultimate tensile is not useless data, but peel strength (IPC-TM-650 2.4.8)
> is generally considered a better model of foil adhesion to laminate.
>
> Chris Mahanna
> Robisan Laboratory Inc.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun
> Sent: Monday, September 28, 2015 6:45 AM
> To: [log in to unmask]
> Subject: [TN] Land bond strength on rigid board
>
> Hi Experts:
>
> Is there have a standard for SMT Land bond strength test? What about the
> formula for force calculation?
> Can I use “IPC-TM-650 2.4.21 Land Bond Strength, Unsupported Component
> Hole” for reference?
>
>
>
>
> Best regards
>
> RongJun Deng
> Electronics Engineer
> Design Link
>
>
>
>
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