So what you are all saying is that if joints break they are a fail, but if
they don't they are not a pass.
ON SMT boards of course the pads will usually come off before the solder
breaks. There are some papers by such as Dage on predictive mechanical
testing but I am not wholly convinced.

 
--
Best Wishes
 
 
 
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, September 25, 2015 2:30 PM
To: [log in to unmask]
Subject: Re: [TN] Component solder reliability

DFR need a lot more.  here is the flavor
http://www.dfrsolutions.com/software/see-what-sherlock-can-do-for-you-2/
> It depends.
>
> There are SO many factors affecting initial joint strength, pad size being
> just one.  The perfect pad size, in the wrong place, with the wrong solder
> or poor processing can make a very weak joint.
>
> And still, it's no measure of reliability.  Poor solder joints are more
> likely to be weak.  Poor solder joints are more likely to be less
> reliable.  But poor older joints could pass an initial pull test and still
> propagate cracks and fail later in life.
>
> Peter
>


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