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September 2015

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Subject:
From:
"Peter G. Houwen" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter G. Houwen
Date:
Fri, 25 Sep 2015 07:17:15 -0500
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It depends.

There are SO many factors affecting initial joint strength, pad size being just one.  The perfect pad size, in the wrong place, with the wrong solder or poor processing can make a very weak joint.

And still, it's no measure of reliability.  Poor solder joints are more likely to be weak.  Poor solder joints are more likely to be less reliable.  But poor older joints could pass an initial pull test and still propagate cracks and fail later in life.

Peter

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