The package types will play a role in the remaining thickness.

My QFN's are 2 to 4 times the thickness of the solder under the component
of leaded or end terminated devices.

No wicking up the sides for the QFN's.

On Tue, Sep 15, 2015 at 1:52 PM, Mumtaz Bora <[log in to unmask]> wrote:

> Dear All,  Does anyone have estimates ,measurements or  correlation for
> printed paste thickness ( lead free- No clean) vs reflowed paste  height
> for the 5 mil and 4 mil  paste print thicknesses.
>
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine  Semiconductor
>
>
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