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September 2015

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TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
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Tue, 15 Sep 2015 16:15:19 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Larry Dzaugis <[log in to unmask]>
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The package types will play a role in the remaining thickness.

My QFN's are 2 to 4 times the thickness of the solder under the component
of leaded or end terminated devices.

No wicking up the sides for the QFN's.

On Tue, Sep 15, 2015 at 1:52 PM, Mumtaz Bora <[log in to unmask]> wrote:

> Dear All,  Does anyone have estimates ,measurements or  correlation for
> printed paste thickness ( lead free- No clean) vs reflowed paste  height
> for the 5 mil and 4 mil  paste print thicknesses.
>
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine  Semiconductor
>
>
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