Sender: |
|
X-To: |
|
Date: |
Tue, 15 Sep 2015 16:15:19 -0400 |
Reply-To: |
|
Subject: |
|
From: |
|
Message-ID: |
|
In-Reply-To: |
|
Content-Type: |
text/plain; charset=UTF-8 |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
The package types will play a role in the remaining thickness.
My QFN's are 2 to 4 times the thickness of the solder under the component
of leaded or end terminated devices.
No wicking up the sides for the QFN's.
On Tue, Sep 15, 2015 at 1:52 PM, Mumtaz Bora <[log in to unmask]> wrote:
> Dear All, Does anyone have estimates ,measurements or correlation for
> printed paste thickness ( lead free- No clean) vs reflowed paste height
> for the 5 mil and 4 mil paste print thicknesses.
>
>
> Thank-you
> Mumtaz
> 858-795-0112
> Peregrine Semiconductor
>
>
> CONFIDENTIALITY NOTE: The information transmitted, including attachments,
> is intended only for the person(s) or entity to which it is addressed and
> may contain confidential and/or privileged material. Any review,
> retransmission, dissemination or other use of, or taking of any action in
> reliance upon this information by persons or entities other than the
> intended recipient is prohibited. If you received this in error, please
> contact the sender and destroy any copies of this information.
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|