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September 2015

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TechNet <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>
Date:
Mon, 28 Sep 2015 10:45:18 +0000
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TechNet E-Mail Forum <[log in to unmask]>, Deng RongJun <[log in to unmask]>
Subject:
Land bond strength on rigid board
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Deng RongJun <[log in to unmask]>
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Hi Experts:

Is there have a standard for SMT Land bond strength test? What about the formula for force calculation?
Can I use “IPC-TM-650 2.4.21 Land Bond Strength, Unsupported Component Hole” for reference?




Best regards

RongJun Deng
Electronics Engineer
Design Link




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