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August 2015

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Subject:
From:
Adrian Dimulescu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Adrian Dimulescu <[log in to unmask]>
Date:
Thu, 27 Aug 2015 09:49:45 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Hi Steve,

Thanks for helping; image is attached.

Regards,
Adrian


________________________________
Adrian Dimulescu | Advanced Engineer | MtronPTI (NYSE MKT: LGL)
2525 Shader Rd, Orlando, FL 32804
Office: 407.298.2000



From: Steve Gregory [mailto:[log in to unmask]]
Sent: Thursday, August 27, 2015 9:47 AM
To: TechNet E-Mail Forum; Adrian Dimulescu
Subject: Re: [TN] Assembly Method - IPC Class 2 or 3?

Hi Adrian,
The TechNet server strips all attachments, but if you want to reply to this message and send your picture to me I'll post it on my web page so everyone can see...
Steve Gregory

On Thu, Aug 27, 2015 at 7:27 AM, Adrian Dimulescu <[log in to unmask]<mailto:[log in to unmask]>> wrote:
We are looking at different methods of attaching a pin to a PCB assembly but are not sure if it's Class 2 or 3 acceptable.  Per attached picture, we want to solder a pin into a plated edge-wrapped slot located at the edge of the board.

Does anybody know if this is acceptable per IPC requirements?  I searched IPC-610 but couldn't find anything similar to this.

Adrian Dimulescu
MtronPTI
[log in to unmask]<mailto:[log in to unmask]>
(407) 298-2000 x2263<tel:%28407%29%20298-2000%20x2263>


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