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August 2015

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From:
Guy Ramsey <[log in to unmask]>
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Date:
Wed, 12 Aug 2015 07:02:29 -0400
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Very interesting addition to this discussion. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Tuesday, August 11, 2015 5:16 PM
To: [log in to unmask]
Subject: Re: [TN] immersion silver

Hi Joyce-

I thought perhaps someone smarter than me would give a carefully thought out
response to your intelligent question, but it seems it was ignored, or went
into my auto-junk machine, or maybe I've gone blind.

Anyway, at some point in the 2000's the definition of "Immersion plating"
got changed. I believe this happened because the immersion plating of your
definition was extremely easy to use and care for. So people asked for
"immersion" and the salesmen started claiming that finishes were "immersion"
when they were actually "electroless" (which are a pain in the rear to
apply, manage, and dispose of). I think Uyemura was the first to do this,
advertising a thick "immersion gold". I remember going to their booth at IPC
that year and trying to figure out what was going on, and when I did my
impression was the salesman hid behind the "language barrier".

So "immersion" now means any plating which uses no electrodes, and is put on
"kind of" thin through careful process control.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 11, 2015 12:08 PM
To: [log in to unmask]
Subject: Re: [TN] immersion silver

gurus, I need some education: Immersion process what I know of is surface
ionic exchange process, once it covered surface, the chemistry stops, so it
is a self limiting process.  What is thin and thick?  you means it can
really gets thicker like electroless type?  not self limiting?  Many thanks.
Best regards,
                           jk
> From memory the "thin" and "thick" silver finish classes recognised 
> that there were two competing but roughly equally popular IAg 
> chemistries in the industry , each with their own process max-min 
> deposit thicknesses and one typically thicker than the other.
>
> Clearly it didn't make sense for an IPC spec to have a "barn door" 
> range from minimum "thin" to maximum "thick", hence two ranges 
> defined. I don't recall one being "better" than the other because of 
> the thickness
>


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