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August 2015

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 11 Aug 2015 13:32:54 +0000
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Mine also.
And I miss Werner; he was one of a kind.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Tuesday, August 11, 2015 6:36 AM
To: [log in to unmask]
Subject: Re: [TN] immersion silver

If Werner were alive he would be reminding us that silver, like gold, is a contaminate in tin solder. 
Early finishes, prior to 2005 or so, weren't good for multiple reflows. Some presumed it was too thin.
I believe the problem was the durability of the organic additives that retard oxidation of the silver.
Not perfect, but it is my preferred surface finish, but not too thick.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Monday, August 10, 2015 3:47 PM
To: [log in to unmask]
Subject: [TN] immersion silver

Hi All,
Why would someone choose thick immersion silver over thin? Are these different chemistries? Regards Steve Kelly


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