Hi Guy,

With all due respect to Warner memory, silver IS NOT like gold and DOES NOT cause embrittlement.

Therefore, from the reliability point of view it wouldn't matter what thickness of IAg was on a board, as long as we ONLY talking about the amount of Ag which would and up in the joints after re-flow.

Regards,

 Vladimir

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  Original Message  
From: Guy Ramsey
Sent: Tuesday, August 11, 2015 07:37
To: [log in to unmask]
Reply To: [log in to unmask]
Subject: Re: [TN] immersion silver

If Werner were alive he would be reminding us that silver, like gold, is a
contaminate in tin solder. 
Early finishes, prior to 2005 or so, weren't good for multiple reflows. Some
presumed it was too thin.
I believe the problem was the durability of the organic additives that
retard oxidation of the silver.
Not perfect, but it is my preferred surface finish, but not too thick. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Monday, August 10, 2015 3:47 PM
To: [log in to unmask]
Subject: [TN] immersion silver

Hi All,
Why would someone choose thick immersion silver over thin? Are these
different chemistries? Regards Steve Kelly


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