Hello Ricardo - as long as the gold thickness of the thermal plane is thin
enough that you will not have a solder joint gold embrittlement situation
occur then soldering the thermal plane should not be an issue. In fact,
having an as-plated surface rather than a pretinned surface would be
significantly more manufacturing friendly and therefore favored.

Dave Hillman
Rockwell Collins
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On Fri, Aug 7, 2015 at 2:25 PM, Ricardo Moncaglieri <
[log in to unmask]> wrote:

> Estimated colleagues,
> In some cases component´s thermal planes Au finished which will be
> solded on ENEPIG TMM10 pcb where coplanarity is very critical then
> pretining modify undesirably coplanarity.
> Taking into account this fact, we have reflowed the component (solder
> the earth plane to pcb) without pretining and compare soldering under RX
> to another done with pretining. Have found out no difference between
> both cases (with and without pretining).
> Furthermore will run some tracking tests to verify joint.
>
> My question:
>
> Do you know or have any background experience on soldering Au finished
> thermal planes without pretining?
> In all other cases of Au components terminals finished, we always
> remove Au.
>
> brgds,Ricardo
>
>
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