It seems similar "more" towards IPC 620...soldering wire to solder cap/pin. The joints seems good but you have to ensure mechanical stress relief is designed within the whole module where these boards are installed.
________________________________________
From: TechNet [[log in to unmask]] on behalf of Adrian Dimulescu [[log in to unmask]]
Sent: Friday, 28 August, 2015 9:41:09 PM
To: [log in to unmask]
Subject: Re: [TN] Assembly Method - IPC Class 2 or 3?

Hi James,

We want to avoid installing the straight lead directly to a PCB pad.  Due to the mechanical construction of the housing, we cannot form the leads prior to pin installation (nor after) to add stress relief.  The only other option is to use "jumper" wires between the pin and PCB, which is more labor intensive.

Thanks,
Adrian

-----Original Message-----
From: James Head [mailto:[log in to unmask]]
Sent: Friday, August 28, 2015 4:51 AM
To: TechNet E-Mail Forum; Adrian Dimulescu
Subject: RE: [TN] Assembly Method - IPC Class 2 or 3?

Can I ask why you are doing it this way?  Is for mechanical reasons or a component that's fitted after solderbath?

James



________________________________
Adrian Dimulescu | Advanced Engineer | MtronPTI (NYSE MKT: LGL)
2525 Shader Rd, Orlando, FL 32804
Office: 407.298.2000






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